Researchers in Korea and Japan propose sideways-stacked DRAM designs to tackle AI memory heat wall

Researchers from Korea and Japan introduce V-Die and MOSAIC designs that stack DRAM sideways to improve cooling, bandwidth, and capacity for AI memory, potentially surpassing conventional HBM limits.

• Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs